Details
Product name:Tetraphenyl resorcinol bis(diphenylphosphate)
MF：C30H24O8P2
MW：574.45
CAS：57583-54-7
EINECS: 260-830-6
Appearance: colorless liquid
Specification
| Item | Value |
| Sample | available |
| Boiling point | 587.1±33.0 °C(Predicted) |
| Density | 1.347 |
Purity
| 99%min |
| Packing | 250kg/drum |
Application
Used for preparing a thermosetting cyanate ester resin composition, comprising the following components: multifunctional cyanate ester, epoxy resin, and flame retardant. The thermosetting cyanate ester resin composition further comprises inorganic fillers. The thermosetting resin composition of the present invention is used for preparing resin sheets, resin composite metal copper foils, prepregs, laminates, copper-clad chemical book board laminates, printed circuit boards, and the like. The resin composition of the present invention has excellent heat resistance, moisture resistance, flame retardancy, and low coefficient of thermal expansion. The phosphorus based flame retardant is selected from tris (2,6-dimethylphenyl) phosphine, resorcinol bis [di (2,6-dimethylphenyl) phosphate], resorcinol tetraphenyldiphosphate, etc.
